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Diamond Heat Sink Used in Electronic Component

Application

It can be applied to the third generation semiconductor high-power devices, high-power lasers and microelectronic thermal sink devices.

  • 产品概述
  • Thermal Conductivity
    Polycrystalline Diamond
    800~1500W/(m·K)
    Single Crystalline Diamond
    1500~2300W/(m·K)
    Thermal Expansion
    10-6·K-1

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